Method and apparatus for sputter deposition of multilayer films
US6497799B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Apr 11, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/165
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for forming a multilayer film on at least one surface of a substrate comprises a vacuum chamber including:(a) a pair of parallel top and bottom walls connected by a side wall;(b) at least one entry/exit means in the side wall for insertion and withdrawal of a substrate from the chamber;(c) a plurality of spaced-apart, radially extending, linearly elongated sputtering sources arranged in a co-planar array adjacent one of the top or bottom walls of the chamber, each of the linearly elongated sputtering sources having a length and a width; and(d) a gripper/transporter for gripping and moving a substrate in a generally circular, planar path past each of the plurality of radially extending sputtering sources, such that the at least one deposition surface of the substrate faces each of the sputtering sources during movement along the circular path, for deposition of the multilayer film thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.