Electroplating apparatus with segmented anode array
US6497801B1 · kind B1 · utility
86Cited by
9References
14Claims
0Family size
Inventors
Key dates
| Filing date | Jul 10, 1998 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Jul 10, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.