Leadless plastic chip carrier with etch back pad singulation
US6498099B1 · kind B1 · utility
410Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1999 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Apr 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip may then be performed by saw singulation or die punching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.