Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
US6498101B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2000 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Feb 28, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Planarizing pads and methods for making or using planarizing pads to polish or planarize semiconductor wafers, field emission displays, or other microelectronic substrates and substrate assemblies. In one embodiment, the planarizing pad comprises a compressible body and a plurality of discrete contact elements. The compressible body can comprise a base having a backside facing a support surface of a table and a front side facing away from the support surface. The contact elements can comprise raised sections of a single layer or separate plates. The contact elements have a bottom surface attached to the front side of the base and a top surface configured to contact a microelectronic substrate facing away from the base. The compressible body has a first hardness and the contact elements have a second hardness greater than the first hardness, and/or the body has a first compressibility and the contact elements have a second compressibility less than the first compressibility. The compressible body can be a compressible foam (e.g., foamed polyurethane), and the contact elements can be a hard, rigid material (e.g., polycarbonate, resin, polyester or high density polyurethane). In opera…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.