Thermally degradable epoxy underfills for flip-chip applications
US6498260B2 · kind B2 · utility
8Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2001 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Mar 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.