Thin film capacitance device and printed circuit board
US6498714B1 · kind B1 · utility
31Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2000 |
| Grant date | Dec 24, 2002 |
| Priority date | — |
| Expiry date | Oct 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a thin film capacitor device having a copper wiring layer, a dielectric layer, and a barrier layer interposed between the wiring layer and the dielectric layer. The barrier layer has the function of preventing diffusion of copper of the wiring layer. The thin film capacitor device may also include an insulating substrate, a planarizing layer, an adhesion layer, and an intermediate layer. The present invention may also relate to a printed circuit substrate having the described thin film capacitor device built therein as a capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.