Akihito Takano
12Patents
5h-index
17Co-inventors
59Inventor score
Filing activity: Oct 4, 2000 → Aug 10, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6498714B1 | Thin film capacitance device and printed circuit board | Electricity | 31 | Expired |
| US7319049B2 | Method of manufacturing an electronic parts packaging structure | Electricity | 26 | Expired |
| US6891732B2 | Multilayer circuit board and semiconductor device using the same | Electricity | 11 | Expired |
| US6754952B2 | Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7161242B2 | Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element | Electricity | 6 | Expired |
| US8669643B2 | Wiring board, semiconductor device, and method for manufacturing wiring board | Electricity | 4 | Active |
| US8058717B2 | Laminated body of semiconductor chips including pads mutually connected to conductive member | Electricity | 3 | Active |
| US8810007B2 | Wiring board, semiconductor device, and method for manufacturing wiring board | Electricity | 2 | Active |
| US7358591B2 | Capacitor device and semiconductor device having the same, and capacitor device manufacturing method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8101461B2 | Stacked semiconductor device and method of manufacturing the same | Electricity | 1 | Active |
| US8446013B2 | Wiring substrate and method for manufacturing the wiring substrate | Electricity | 1 | Active |
| US8766101B2 | Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.