Oscillating orbital polisher and method
US6500055B1 · kind B1 · utility
11Cited by
19References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2000 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Sep 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.