Method of forming bonded storage disks with low power light assembly

US6500297B1 · kind B1 · utility

Assignee

• Steag Hamatech AG · US

Inventors

• Joseph W. Paulus · Portland, US
• Kendrick H. Light · Frye Island, US
• Scott R. Parent · Saco, US
• Donald G. Parent · Frye Island, US
• Arthur R. LeBlanc, III · Kennebunk, US
• Elango Ramanathan · Scarborough, US
• Aziz Calcuttawala · Pelham, US
• Richard W. Stowe · Hillandale, US

Key dates

• Filing date: Feb 4, 2000
• Grant date: Dec 31, 2002
• Expiry date: Feb 4, 2020

Classification

• Technology area (CPC G): Physics
• CPC primary: G11B23/0021
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.