Integrated circuit tester with high bandwidth probe assembly
US6501343B2 · kind B2 · utility
96Cited by
22References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 2001 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Mar 13, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.