Heatsink mounting with shock absorbers
US6501658B2 · kind B2 · utility
38Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2001 |
| Grant date | Dec 31, 2002 |
| Priority date | — |
| Expiry date | Feb 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Shock absorbers or other dampening mechanisms are added to an assembly including a heatsink, a semiconductor device, and a board, to reduce shock and/or vibration induced relative motion between the heatsink and the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.