Patent · US Expired

Process for producing nanoporous dielectric films at high pH

US6503850B1 · kind B1 · utility

15Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 1998
Grant dateJan 7, 2003
Priority date
Expiry dateMar 25, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02282
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. A precursor of an alkoxysilane, and low and high volatility solvents are mixed at a pH of about 2-5, raised to a pH of about 8 or above with a low volatility base and deposited on a semiconductor substrate. After exposure to atmospheric moisture, a nanoporous dielectric film is produced on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.