Patent · US Expired

Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array

US6504104B2 · kind B2 · utility

30Cited by

9References

9Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hans-Juergen Hacke · Munich, DE
Manfred Wossler · Munich, DE
Karl Weidner · Birkenfeld, DE
Wolfgang Radlik · Munich, DE

Key dates

Filing date	Apr 30, 2001
Grant date	Jan 7, 2003
Priority date	—
Expiry date	Apr 30, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.