Electronic assembly having a wetting layer on a thermally conductive heat spreader
US6504242B1 · kind B1 · utility
51Cited by
35References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2001 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Nov 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.