Carl Deppisch
42Patents
10h-index
69Co-inventors
78Inventor score
Filing activity: Apr 18, 1997 → Sep 18, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6504242B1 | Electronic assembly having a wetting layer on a thermally conductive heat spreader | Electricity | 51 | Expired |
| US6867978B2 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Electricity | 33 | Expired |
| US7362580B2 | Electronic assembly having an indium wetting layer on a thermally conductive body | Electricity | 23 | Expired |
| US6848172B2 | Device and method for package warp compensation in an integrated heat spreader | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6504723B1 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7955900B2 | Coated thermal interface in integrated circuit die | Electricity | 18 | Active |
| US6751099B2 | Coated heat spreaders | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7672132B2 | Electronic packaging apparatus and method | Electricity | 14 | Active |
| US7036573B2 | Polymer with solder pre-coated fillers for thermal interface materials | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6471792B1 | Stress relaxation resistant brass | Chemistry; Metallurgy | 11 | Expired |
| US7102226B2 | Device and method for package warp compensation in an integrated heat spreader | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7821126B2 | Heat sink with preattached thermal interface material and method of making same | Electricity | 10 | Active |
| US6132528A | Iron modified tin brass | Chemistry; Metallurgy | 9 | Expired |
| US5853505A | Iron modified tin brass | Chemistry; Metallurgy | 9 | Expired |
| US8242602B2 | Composite solder TIM for electronic package | Electricity | 8 | Active |
| US7439617B2 | Capillary underflow integral heat spreader | Electricity | 7 | Active |
| US8409929B2 | Forming a semiconductor package including a thermal interface material | Electricity | 6 | Active |
| US7704798B2 | Electronic assemblies with hot spot cooling and methods relating thereto | Emerging Cross-Sectional Technologies | 6 | Active |
| US8809181B2 | Multi-solder techniques and configurations for integrated circuit package assembly | Electricity | 6 | Active |
| US7436058B2 | Reactive solder material | Electricity | 5 | Expired |
| US7081669B2 | Device and system for heat spreader with controlled thermal expansion | Electricity | 5 | Expired |
| US7219421B2 | Method of a coating heat spreader | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6817091B2 | Electronic assembly having solder thermal interface between a die substrate and a heat spreader | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9330999B2 | Multi-component integrated heat spreader for multi-chip packages | Emerging Cross-Sectional Technologies | 5 | Active |
| US8550327B2 | Clad solder thermal interface material | Emerging Cross-Sectional Technologies | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.