Electronic assembly having solder thermal interface between a die substrate and a heat spreader
US6504723B1 · kind B1 · utility
21Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2001 |
| Grant date | Jan 7, 2003 |
| Priority date | — |
| Expiry date | Nov 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.