Method and apparatus for use in assembling electronic devices
US6505665B1 · kind B1 · utility
13Cited by
83References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1998 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Sep 17, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first fixture holds a plurality of circuit components backside up in a substantially coplanar relationship. An adhesive applying device, such as screen printer, applies adhesive to the backside of each circuit component. A second fixture is aligned with and placed on the first fixture. The fixtures are then flipped so that the circuit components are supported in a right side up position by the second fixture. A device such as a pick and place machine, may then be used to transfer the circuit components from the second fixture to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.