Method and apparatus for mounting component
US6506222B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2001 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Jun 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.