Patent · US Expired

Method and an apparatus for treating wastewater from a chemical-mechanical polishing process used in chip fabrication

US6506306B1 · kind B1 · utility

4Cited by

6References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Jürgen Hammer · Idar-Oberstein, DE
Andre Richter · Neustadt in Sachsen, DE
Werner Kraus · Teublitz, DE
Heinz-Dieter Petermann · Stuttgart, DE

Key dates

Filing date	Oct 28, 1999
Grant date	Jan 14, 2003
Priority date	—
Expiry date	Oct 28, 2019

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC02F1/442
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

Wastewater from a chemical-mechanical polishing process (CMP) used in semiconductor chip fabrication has hitherto been, and is still being, discharged into the public sewage system after chemical neutralization and sedimentation. This has the drawback that water consumption is considerable. It is therefore an object of the invention to reduce the total amount of wastewater produced that has to be discharged. This is achieved by the wastewater to be treated being subjected to an ultra-filtration, and at least one of NF an RO. This allows the treated CMP wastewater to be reused within the plant. In particular, it can be recycled in order again to recover therefrom deionized water of a very high purity for operational purposes, e.g. for CMP.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.