Anti-corrosion system
US6506684B1 · kind B1 · utility
9Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | May 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02071
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for etching a surface of an integrated circuit. A layer of photoresist is applied to the surface of the integrated circuit. The layer of photoresist is exposed and developed, and the surface of the integrated circuit is etched with an etchant that contains chlorine. The surface of the integrated circuit is exposed to tetra methyl ammonium hydroxide to neutralize the chlorine, and rinsed with water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.