Patent · US Expired

Power semiconductor module

US6507108B1 · kind B1 · utility

5Cited by

8References

10Claims

0Family size

Assignee

IXYS Semiconductor GmbH · DE

Inventors

Andreas Lindemann · Lampertheim, DE
Bernt Leukel · Hemsbach, DE

Key dates

Filing date	Sep 7, 2000
Grant date	Jan 14, 2003
Priority date	—
Expiry date	Sep 7, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a power semiconductor module (10) having a baseplate (1) on which at least one substrate (13) is arranged which is fitted with power semiconductor chips (11, 12) and can be pressed via pressure elements and contact cords (17) against the baseplate (1). The baseplate (1) has centering elements on which a frame (3) which defines fields (7) and is in the form of a grid is provided, with corresponding substrates (13) with power semiconductor chips being arranged in at least some of the fields (7), which substrates (13) can be made contact with via contact rails (15).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.