Microwave device and method for making same
US6507110B1 · kind B1 · utility
15Cited by
18References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Mar 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave device, including a substrate having a first surface and a second surface, a plurality of electrically conductive vias extending through the substrate from the first surface to the second surface, a first interconnect trace connected to the first surface of the substrate and electrically connected to a first of the plurality of vias, a second interconnect trace connected to the first surface of the substrate and electrically connected to a second of the plurality of vias, and a microwave circuit chip connected to the second surface of the substrate and electrically connected to the first and second conductive vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.