Flip chip type quad flat non-leaded package
US6507120B2 · kind B2 · utility
195Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Dec 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip type quad flat non-leaded package, comprising: a plurality of leads each having a first surface and a second surface opposite to the first surface; a die having an active surface and a backside opposite the active surface, wherein the active surface has a plurality of bonding pads, each having a bump, and wherein each bump is connected to a first surface of one of the leads respectively; and a molding compound encapsulating the leads and the die, exposing second surfaces of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.