Semiconductor testing equipment with probe formed on a cantilever of a substrate
US6507204B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2000 |
| Grant date | Jan 14, 2003 |
| Priority date | — |
| Expiry date | Mar 9, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The conventional semiconductor element testing equipment is arranged to position each probe accurately and need a burdensome operation for fixing, and includes only a limited number of electrode pads and chips to be tested at a batch. An equipment for testing a semiconductor element is arranged to keep each of electrode pads formed on a semiconductor element to be tested in direct contact with each of probes formed on a first substrate composed of silicon, one of electric connecting substrates disposed in the equipment. On the first substrate, each probe is formed on a cantilever and a wire is routed from a tip of each probe along a tip of the cantilever to the electrode pad formed on an opposite surface to the probe forming surface through an insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.