Microelectromechanical structure insensitive to mechanical stresses
US6508124B1 · kind B1 · utility
55Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Sep 19, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0109
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microelectromechanical structure includes a rotor element having a barycentric axis and suspended regions arranged a distance with respect to the barycentric axis. The rotor element is supported and biased via a suspension structure having a single anchoring portion extending along the barycentric axis. The single anchoring portion is integral with a body of semiconductor material on which electric connections are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.