Wafer-polishing head and polishing apparatus having the same
US6508696B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Aug 25, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer-polishing head which has an increased flexible membrane life and improved wafer polishing accuracy has a principal head 106 having a lower opening portion 106a with an approximately circular shape. A flexible membrane 2 which is positioned in the opening portion 106a of the principal heal head 106 for closing the opening portion 106a and for holding a wafer W at the underside of an inward peripheral portion 2a of the flexible membrane. A sealed pressurizing chamber 107 is formed by closing the opening portion 106a with the flexible membrane. A pressure regulator is provided for controlling the internal pressure of the pressurizing chamber 107. The flexible membrane 2 is thicker in an outer peripheral portion 2b thereof than in the inward peripheral portion 2a which holds the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.