Patent assignee · US · COMPANY

Multiplanar Technologies Incorporated

11Patents
0Active
11Granted
28Portfolio score

Filing activity: May 12, 2000 → Mar 27, 2003

Most-cited patents

PatentTitleAreaCited byStatus
US6506105B1 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control Performing Operations; Transporting 61 Expired
US6558232B1 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Performing Operations; Transporting 51 Expired
US6623343B2 System and method for CMP head having multi-pressure annular zone subcarrier material removal control Performing Operations; Transporting 28 Expired
US6893327B2 Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface Performing Operations; Transporting 19 Expired
US6887132B2 Slurry distributor for chemical mechanical polishing apparatus and method of using the same Performing Operations; Transporting 17 Expired
US6540590B1 Chemical mechanical polishing apparatus and method having a rotating retaining ring Performing Operations; Transporting 13 Expired
US6527625B1 Chemical mechanical polishing apparatus and method having a soft backed polishing head Performing Operations; Transporting 10 Expired
US6508696B1 Wafer-polishing head and polishing apparatus having the same Performing Operations; Transporting 8 Expired
US7118456B2 Polishing head, retaining ring for use therewith and method fo polishing a substrate Performing Operations; Transporting 6 Expired
US6966822B2 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control Performing Operations; Transporting 6 Expired
US6641461B2 Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal Performing Operations; Transporting 2 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.