Method for forming structures on a wafer
US6509208B1 · kind B1 · utility
2Cited by
4References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2001 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Sep 14, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a structure on an integrated circuit wafer, includes applying an anti-sticking coating to a surface of a mold, depositing a first material on the anti-sticking coating, and removing a portion of the first material to expose the anti-sticking coating. A first interface between the mold and the first material has a first adhesiveness. The process also includes placing the anti-sticking coating in contact with the wafer, and removing the mold from the wafer. A second interface between the first material and the wafer has a second adhesiveness that is greater than the first adhesiveness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.