Laser excision of laminate chip carriers
US6509546B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Mar 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0909
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and associated structure for excising laminate chip carriers from a panel that has a thickness less than about 100 mils. A laser beam is focused on a surface of the panel, and the panel is moved relative to the laser beam in a geometric pattern, such that cells of the panel (e.g., chip carriers) are excised from the panel. The laser parameters include a wavelength between about 500 nanometers and about 600 nanometers, a pulse width greater than about 100 nanoseconds and less than about 350 nanoseconds, an average power of at least about 1 watt, a pulse repetition rate between about 5,000 pulses/sec and about 20,000 pulses/sec, and a target diameter (D) between about 2 microns and about 30 microns. The kerf width between adjacent excised cells is between about 2 microns and about 75 microns. The width of an excised cell is at least 5 mm. A displacement between successive pulses of the laser beam is less than about 2D. The panel may comprise a layered structure that includes an organic layer and a metal layer. The laser includes, inter alia, a lasant of Nd:YAG, Nd:YLF, Nd:YAP, or Nd:YVO4. The method of the present invention wastes less panel area by at least a factor of abou…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.