IC package capable of accommodating discrete devices
US6509633B1 · kind B1 · utility
3Cited by
1References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC (Integrated Circuit) package includes a package body having a cavity formed for receiving an IC chip therein. A terrace protrudes from at least part of the edges defining the cavity into the cavity. Discrete devices can be mounted on the terrace, i.e., inside the IC package. With this configuration, the IC package insures the stable operation of a high-frequency IC circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.