Projection exposure method, manufacturing method for device using same, and projection exposure apparatus
US6509956B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 10, 2001 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | May 10, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70258
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A projection exposure apparatus is provided which prevents a deterioration in alignment accuracy even if a deviation of the optical axis occurs with projection magnification adjustment of a projection optical system.After the projection magnification of a projection optical system is adjusted based on measurement results of marks formed on a substrate mounted on a substrate stage, the substrate is exposed by a predetermined pattern via the projection optical system. Information related to an imaging position of the projection optical system is measured after adjustment of the projection magnification and before exposure of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.