Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
US6510059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2001 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | Jul 18, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.