Automatic detection of die absence on the wire bonding machine
US6510240B1 · kind B1 · utility
2Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 1995 |
| Grant date | Jan 21, 2003 |
| Priority date | — |
| Expiry date | May 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus detects the presence or absence of a semiconductor device. The apparatus includes a wire bonding machine to form a connection with the semiconductor device, and a camera to form an image of a position of the semiconductor device. A processor controls the wire bonding machine and transforms the image to pixel data. Additionally, the processor converts the pixel data to discrimination data to indicate whether the semiconductor device is present. The processor controls the wire bonding machine in accordance with the presence or the absence of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.