Yee Hsun U
2Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: May 9, 1995 → Dec 1, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5981370A | Method for maximizing interconnection integrity and reliability between integrated circuits and external connections | Electricity | 2 | Expired |
| US6510240B1 | Automatic detection of die absence on the wire bonding machine | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.