Substrate support and method of fabricating the same
US6510888B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2001 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Aug 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12535
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A substrate support and method of fabricating the same are provided. Generally, one method of fabrication includes assembling a subassembly comprising a first reinforcing member and a heating element, supporting the subassembly at least 40mm from a bottom of a mold, encapsulating the supported subassembly with molten aluminum, and applying pressure to the molten aluminum. Alternatively, a method of fabrication includes assembling a subassembly comprising a stud disposed through a heating element sandwiched between a first reinforcing member and a second reinforcing member, supporting the subassembly above a bottom of a mold, encapsulating the subassembly disposed in the mold with molten aluminum to form a casting, forming a hole in the casting by removing at least a portion of the stud, and disposing a plug in at least a portion of the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.