Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site
US6511347B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2001 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Jun 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to electrically connecting a first electronic component to a second electronic component wherein at least one of the electronic components must undergo modifications or repair when, for example, there is a floating signal generated from the first electronic component which can cause problems in operation of the electronic component assembly. For this type assembly an opening is provided in the second electronic component proximate the site or sites to be electrically connected to the first electronic component, which opening extends to an internal plane of the second electronic component desired to be connected to the first electronic component. A wire having a melting point higher than the solder used to make the assembly is used to connect the internal plane of the second electronic component to the pad of the second electronic component which second electronic component is to be electrically connected to the first electronic component thereby avoiding a floating signal in the electronic component assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.