Patent · US Expired

Apparatus and method for the treatment of substrates

US6512207B1 · kind B1 · utility

31Cited by

4References

19Claims

0Family size

Assignee

Steag Hamatech AG · US

Inventors

Peter Dress · Bruchsal, DE
Uwe Dietze · Sternenfels, DE
Jakob Szekeresch · Westerburg, DE
Robert Weihing · Heuchelheim, DE

Key dates

Filing date	Aug 23, 2001
Grant date	Jan 28, 2003
Priority date	—
Expiry date	Aug 23, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67103
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device and method for thermally treating substrates. A substrate is heated by a heating plate to improve thermal homogeneity. The heating plate is heated using a number of separately controlled heating elements. The temperature of the heating elements is measured and the heating process is controlled by a PID controller. In addition, the temperature of the substrate surface facing away from the heating plate is locally measured. The temperature distribution over the substrate surface is determined according to the measured temperatures and set values for the temperature of the individual heating elements are determined and transmitted to the PID controller.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.