Mechanically interlocking ball grid array packages and method of making
US6512293B1 · kind B1 · utility
6Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2001 |
| Grant date | Jan 28, 2003 |
| Priority date | — |
| Expiry date | Jun 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for providing a ball grid array assembly formed from interlocking ball grid array packages is disclosed. Each of the ball grid array packages has interlocking edge features for mechanical connection, whereby joining the plurality of ball grid array packages via the interlocking edge features forms the interlocking ball grid array assembly. The interlocking ball grid array assembly may then be mounted on a PC board as a single unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.