Nozzle for cleaving substrates
US6513564B2 · kind B2 · utility
68Cited by
184References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Mar 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1928
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.