Semiconductor polishing pad alignment device for a polishing apparatus and method of use
US6514123B1 · kind B1 · utility
12Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2000 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Nov 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/914
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing pad alignment device having an alignment member positionable against a side wall of a platen. The height of the alignment member is sufficient to extend above a top surface of the platen when positioned against the wall of the platen. In one embodiment, the alignment member is an arcuate member having an arc substantially equal to an arc of the platen. In another embodiment, the alignment member is removably attachable to the wall of the platen and the polishing pad alignment member further includes an attachment device configured to attach the alignment member to the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.