Manufacturing a semiconductor wafer according to the process time by process tool
US6514861B1 · kind B1 · utility
5Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2002 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Jun 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor process for manufacturing a wafer. First, a previously predicted process rate and a previously measured process rate are provided by a process tool. Next, a presently predicted process rate is obtained by a first linear equation having a first variable weighting factor using the previously predicted process rate and the previously measured process rate as variables. Next, a process time is obtained according to the presently predicted process rate and a predetermined process target to input to the process tool. Finally, the wafer is manufactured according to the process time by the process tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.