High-speed maskless via generation system
US6515257B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Aug 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
High-performance microelectronic modules, such as chip-scale packages, flip-chip modules, integrated micro-opto-electronic boards, fine-line printed circuits, and system-on-a-package modules, span a range of sizes and interconnect densities. Current technologies for via generation are not optimized for the varied cost considerations of different manufacturing requirements—direct-write tools address low-volume needs, whereas mask-projection systems are designed for very high via-density products. The system disclosed here will be highly cost-efficient for producing a wide range of modules. Its desirable features are high-speed via generation for different via densities, full via-pattern programmability, capability to drill high-threshold photo-ablation substrates, and full and efficient utilization of available high-power excimer lasers. A high-power laser beam is divided into multiple beamlets which are simultaneously directed to different via sites by a spatial light modulator array. Beamlets not needed for via generation are returned to the illumination system and recycled with the beamlets that reach via generation sites. A control system uses via site information and mate…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.