Method and apparatus for testing IC device
US6515470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2001 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Mar 12, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G59/02
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device. As soon as the fresh IC device is set in position in that socket, execution of a test program is started with respect to that socket on the test board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.