Method for a copper CMP endpoint detection system
US6517413B1 · kind B1 · utility
60Cited by
25References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Dec 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A new method is provided for endpoint detection of the polishing of a copper surface. The amount of copper dioxide that is removed from the surface that is being polished is monitored by means of a laser beam that is reflected off the polishing pad that is used for the polishing operation. The reflected light beam is analyzed for color content, based on this analysis it can be determined at what time no more copper dioxide is present on the surface of the polishing pad, which is the time that the process of removing copper from the surface that is being polished is complete. The polishing process is stopped at that time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.