Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus
US6517414B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Mar 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for improving the pad conditioning process of a polishing pad in a chemical-mechanical polishing apparatus employs closed loop control of the polishing pad conditioning process. An arrangement includes a pad conditioning head carried by an arm that is coupled to an arm support located remotely from the conditioning head. A down force sensor in the arm support measures the down force exerted by the pad conditioning head through the conditioning disk. A controller receives the down force measurements from the down force sensor and controls the arm support to controllably vary the down force exerted by the pad conditioning head. The conditioning apparatus is thus controlled in response to the feedback from the down force measurements in a closed loop control to modify the conditioning process and control the pad wear uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.