Polishing pad with a transparent portion
US6517417B2 · kind B2 · utility
28Cited by
13References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jun 22, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A transparent portion of a polishing pad in the solid phase has an index of refraction nearly matched to the index of refraction of a fluid polishing composition for chemical mechanical polishing, which minimizes scattering of an optical beam at an interface of the transparent portion and the polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.