Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure
US6517744B1 · kind B1 · utility
45Cited by
4References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 14, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Apr 10, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C70/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.