Ryoji Setaka
5Patents
5h-index
9Co-inventors
45Inventor score
Filing activity: Nov 14, 2000 → Aug 7, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6517744B1 | Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure | Performing Operations; Transporting | 45 | Expired |
| US7049836B2 | Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method | Electricity | 9 | Expired |
| US7095241B2 | Anisotropic conductive connector, probe member, wafer inspecting device, and wafer inspecting method | Electricity | 9 | Expired |
| US6849335B2 | Anisotropic conductive sheet | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7131851B2 | Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.