Method for fabricating nitride semiconductor device
US6518082B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Mar 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/34333
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
First, the substrate temperature is set to 1020° C., and an n-type cladding layer (14) made of n-type Al0.1Ga0.9N, an n-type optical guide layer (15) made of n-type GaN, and a flatness maintenance layer (16) made of n-type Al0.2Ga0.8N for maintaining the surface flatness of the n-type optical guide layer (15) by suppressing re-evaporation of the constituent atoms of the n-type optical guide layer (15), are grown in this order on a substrate (11) made of sapphire. Then, the supply of a group III material gas is stopped, the substrate temperature is decreased to 780° C., and the carrier gas is switched from a hydrogen gas to a nitrogen gas. Then, an active layer (17) having a multiple quantum well structure is grown by introducing NH3 as a group V source and selectively introducing TMI and TMG as a group III source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.