Multilayered laminate
US6518516B2 · kind B2 · utility
12Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered laminate, substructures and associated methods of fabrication are presented. The multilayered laminate includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures and (c) a second intermediate layer having microvias and conductive lands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.